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BRAND NEW IN FACTORY TRAYS, WILL BAKE OUT AND SEAL ICS PICTURED AT NO ADDITIONAL COST Type Microprocessor Manufacturing process 0.35 micron 4-layer metal CMOS process Data bus width 32 bit Package 352-terminal Ball Grid Array 1.378" x 1.378" (3.5 cm x 3.5 cm) Speed (MHz) 266 Bus frequency (MHz) 33 Clock multiplier 8 On-chip peripherals * PCI controller * Display controller and 2D Graphics accelerator * 64-bit synchronous DRAM controller * Memory Management Unit * Internal Bus Interface Unit Low power features * APM support * CPU only suspend * Suspend modulation * Full 3V suspend Other features MMX multimedia instructions Physical memory (GB) 1 Level 1 cache size 16 KB write-back 4-way set associative unified instruction and data cache Floating Point Unit Integrated V core (V) 2.9 ± 0.15 V I/O or secondary (V) 3.3 ± 0.16 Max operating temperature (°C) 85 Min/Typical/Max power dissipation (W) 3.26 (Suspend mode) / 5.87 / 10.7 Notes: * Interfaces with Cx5520 or Cx5530 companion chips
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